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Life sciences · Preprint
arXiv · October 5, 2026
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As technology scales to smaller nodes, increasing current densities make electromigration (EM) one of the dominant reliability challenges in on-chip interconnects. Accurate transient stress analysis is needed to identify wires susceptible to EM degradation, but applying physics-based solvers across many interconnects remains computationally expensive. This paper proposes a physics-guided transformer framework for fast EM stress prediction in multi-segment interconnect lines. The framework converts each line into geometry- and DC-aware segment tokens and uses transformer attention to capture line-level context. A lightweight query decoder then predicts stress at selected locations and time instants. The model is trained with an objective that combines normalized supervised regression, linewise relative-$L_2$ loss, and physics-guided continuity and terminal-flux terms. Experiments on IBM power grid benchmarks show that the proposed model achieves relative-$L_2$ error below 8\% and reaches up to 2459.68$\times$ speedup compared with the matrix exponential~solver.